ups160e3 1.0 a schottk y barrier rectifier description the microsemi ups160e3 powermite ? schottky rectifier is rohs compliant and offers optimized forward voltage characteristics with reverse blocking capabilities up to 60 volt. they are ideal for surface mount applications that operate at high frequencies. in addition to its size advantages, powermite ? package features include a full metallic bottom that eliminates po ssibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). its innovative design makes this device ideal for use with automatic insertion equipment. important: for the most current data, consult microsemi ?s website: http://www.microsemi.com absolute maximum ratings at 25o c (unless otherwise specified) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 60 v rms reverse voltage v r (rms) 42 v average rectified output current i o 1.0 a non-repetitive peak forward surge current 8.3ms single half sine wave superimposed on rated load@ t c =90 oc i fsm 25 a storage temperature t stg -65 to +150 oc junction temperature t j -65 to +125 oc do-216 see further details and dimensions on last page thermal characteristics (unless otherwise specified) thermal resistance junction-to-case (bottom) r jc 15 oc/ watt junction-to-ambient (1) r ja 240 oc/ watt (1) when mounted on fr-4 pc board using 1 oz copper with recommended minimum foot print key features ? low thermal resistance do-216 package ? rohs compliant with e3 suffix part number ? guard-ring-die construction for transient protection ? efficient heat path with integral locking bottom metal tab ? low forward voltage ? full metallic bottom eliminates flux entrapment ? compatible with automatic insertion ? low profile-maximum height of 1mm ? options for screening in accordance with mil-prf-19500 for jan, jantx, and jantxv are available by adding mq, mx, or mv prefixes respectively to part numbers. for example, designate mxups160e3 for a jantx (consult factory for tin-lead plating). ? optional 100% avionics screening available by adding ma prefix for 100% temperature cycle, thermal impedance and 24 hours htrb (consult factory for tin-lead plating) applicati ons/benefits ? switching and regulating power supplies. ? silicon schottky (hot carrier) rectifier for minimal reverse voltage recovery ? elimination of reverse-recovery oscillations to reduce need for emi filtering ? charge pump circuits ? reduces reverse recove ry loss with low i rm ? small 8.45 mm 2 foot print (see mounting pad details next page) mechanical & packaging ? case: void-free transfer molded thermosetting epoxy compound meeting ul94v-0 ? finish: annealed matte-tin plating over copper and readily solderable per mil- std-750 method 2026 (consult factory for tin-lead plating) ? polarity: see figure (left) ? marking: s60? ? weight: 0.016 grams (approx.) ? package dimension on last page ? tape & reel option: 12 mm tape per standard eia-481-b, 3000 on 7 inch reel and 12,000 on 13? reel www. microsemi . com u u p p s s 1 1 6 6 0 0 e e 3 3 microsemi copyright ? 2007 6-26-2007 rev b page 1
ups160e3 1.0 a schottk y barrier rectifier www. microsemi . com electrical parameters @ 25 c (unless otherwise specified) parameter symbol conditions min typ. max units forward voltage (note 1) v f i f = 1 a , t j =25 oc i f = 2 a , t j =25 oc 0.60 0.86 v reverse breakdown voltage (note 1) v br i r = 0.1 ma 60 v reverse current (note 1) i r v r = 60 v, t j = 25 oc 0.1 ma capacitance c t v r = 4 v; f = 1 mhz 45 55 pf note: 1 short duration test pulse used to minimize self ? heating effect. package & mounting pad dimensions do-216 package (all dimensions +/-.00 5 inches) mounting pad in inches e e l l e e c c t t r r i i c c a a l l s s u u p p s s 1 1 6 6 0 0 e e 3 3 microsemi copyright ? 2007 6-26-2007 rev b page 2
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